Diethyl 2-Propylimidazole-4,5-dicarboxylate - CAS 144689-94-1
Catalog: |
BB009821 |
Product Name: |
Diethyl 2-Propylimidazole-4,5-dicarboxylate |
CAS: |
144689-94-1 |
Synonyms: |
2-propyl-1H-imidazole-4,5-dicarboxylic acid diethyl ester; diethyl 2-propyl-1H-imidazole-4,5-dicarboxylate |
IUPAC Name: | diethyl 2-propyl-1H-imidazole-4,5-dicarboxylate |
Description: | An intermediate in the synthesis of Olmesartan Medoxomil. |
Molecular Weight: | 254.28 |
Molecular Formula: | C12H18N2O4 |
Canonical SMILES: | CCCC1=NC(=C(N1)C(=O)OCC)C(=O)OCC |
InChI: | InChI=1S/C12H18N2O4/c1-4-7-8-13-9(11(15)17-5-2)10(14-8)12(16)18-6-3/h4-7H2,1-3H3,(H,13,14) |
InChI Key: | ZQPMIDPIXSMOAD-UHFFFAOYSA-N |
Boiling Point: | 400.9 °C at 760 mmHg |
Density: | 1.16 g/cm3 |
MDL: | MFCD08062365 |
LogP: | 1.71560 |
Publication Number | Title | Priority Date |
CN-113336706-A | Synthetic method for preparing olmesartan medoxomil intermediate by continuous flow | 20210615 |
CN-112337419-A | Preparation method of 4- (1-hydroxy-1-methylethyl) -2-propylimidazole-5-carboxylic acid ethyl ester | 20201027 |
CN-111205229-A | Preparation method of 2-propyl-4, 5-imidazole dicarboxylic acid diethyl ester | 20200222 |
CN-112778209-A | Preparation method of diacid | 20191104 |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
Complexity: | 296 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 254.12665706 |
Formal Charge: | 0 |
Heavy Atom Count: | 18 |
Hydrogen Bond Acceptor Count: | 5 |
Hydrogen Bond Donor Count: | 1 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 254.12665706 |
Rotatable Bond Count: | 8 |
Topological Polar Surface Area: | 81.3 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 2.4 |
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