7-(Benzyloxy)-6-methoxyquinazolin-4(3H)-one - CAS 179688-01-8
Catalog: |
BB013593 |
Product Name: |
7-(Benzyloxy)-6-methoxyquinazolin-4(3H)-one |
CAS: |
179688-01-8 |
Synonyms: |
6-methoxy-7-phenylmethoxy-3H-quinazolin-4-one; 6-methoxy-7-phenylmethoxy-3H-quinazolin-4-one |
IUPAC Name: | 6-methoxy-7-phenylmethoxy-3H-quinazolin-4-one |
Description: | 7-(Benzyloxy)-6-methoxyquinazolin-4(3H)-one (CAS# 179688-01-8) is used as a reactant in the preparation of and structure-activity relationship of arylaminoquinazoline VEGF receptor tyrosine kinase inhibitors. |
Molecular Weight: | 282.29 |
Molecular Formula: | C16H14N2O3 |
Canonical SMILES: | COC1=C(C=C2C(=C1)C(=O)NC=N2)OCC3=CC=CC=C3 |
InChI: | InChI=1S/C16H14N2O3/c1-20-14-7-12-13(17-10-18-16(12)19)8-15(14)21-9-11-5-3-2-4-6-11/h2-8,10H,9H2,1H3,(H,17,18,19) |
InChI Key: | ZCUFFSHMOAEEIL-UHFFFAOYSA-N |
Boiling Point: | 475.366 °C at 760 mmHg |
Density: | 1.263 g/cm3 |
LogP: | 2.51070 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation] |
Precautionary Statement: | P264, P280, P302+P352, P305+P351+P338, P321, P332+P313, P337+P313, and P362 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
US-2021277221-A1 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | 20180426 |
Complexity: | 393 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 282.10044231 |
Formal Charge: | 0 |
Heavy Atom Count: | 21 |
Hydrogen Bond Acceptor Count: | 4 |
Hydrogen Bond Donor Count: | 1 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 282.10044231 |
Rotatable Bond Count: | 4 |
Topological Polar Surface Area: | 59.9 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 2.1 |
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