6-Hydroxy-3-pyridazinecarboxylic Acid - CAS 37972-69-3
Catalog: |
BB023478 |
Product Name: |
6-Hydroxy-3-pyridazinecarboxylic Acid |
CAS: |
37972-69-3 |
Synonyms: |
6-oxo-1H-pyridazine-3-carboxylic acid; 6-oxo-1H-pyridazine-3-carboxylic acid |
IUPAC Name: | 6-oxo-1H-pyridazine-3-carboxylic acid |
Description: | 6-Hydroxy-3-pyridazinecarboxylic Acid (CAS# 37972-69-3) is a useful research chemical. |
Molecular Weight: | 140.10 |
Molecular Formula: | C5H4N2O3 |
Canonical SMILES: | C1=CC(=O)NN=C1C(=O)O |
InChI: | InChI=1S/C5H4N2O3/c8-4-2-1-3(5(9)10)6-7-4/h1-2H,(H,7,8)(H,9,10) |
InChI Key: | GIFSROMQVPUQFK-UHFFFAOYSA-N |
Boiling Point: | 518.5 °C at 760 mmHg |
Density: | 1.63 g/cm3 |
MDL: | MFCD09064936 |
LogP: | -0.18390 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation] |
Precautionary Statement: | P261, P264, P271, P280, P302+P352, P304+P340, P305+P351+P338, P312, P321, P332+P313, P337+P313, P362, P403+P233, P405, and P501 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
US-2021277221-A1 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | 20180426 |
Complexity: | 241 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 140.02219199 |
Formal Charge: | 0 |
Heavy Atom Count: | 10 |
Hydrogen Bond Acceptor Count: | 4 |
Hydrogen Bond Donor Count: | 2 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 140.02219199 |
Rotatable Bond Count: | 1 |
Topological Polar Surface Area: | 78.8 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | -0.8 |
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