5-Chloro-2-(methylthio)pyrimidine-4-carboxylic acid - CAS 61727-33-1
Catalog: |
BB031236 |
Product Name: |
5-Chloro-2-(methylthio)pyrimidine-4-carboxylic acid |
CAS: |
61727-33-1 |
Synonyms: |
5-chloro-2-methylsulfanylpyrimidine-4-carboxylic acid |
IUPAC Name: | 5-chloro-2-methylsulfanylpyrimidine-4-carboxylic acid |
Description: | 5-Chloro-2-(methylthio)pyrimidine-4-carboxylic acid (CAS# 61727-33-1) is a synthetic intermediate in the preparation of GSK3β inhibitors and non-nucleoside reverse transcriptase inhibitors for treating HIV infection. |
Molecular Weight: | 204.63 |
Molecular Formula: | C6H5ClN2O2S |
Canonical SMILES: | CSC1=NC=C(C(=N1)C(=O)O)Cl |
InChI: | InChI=1S/C6H5ClN2O2S/c1-12-6-8-2-3(7)4(9-6)5(10)11/h2H,1H3,(H,10,11) |
InChI Key: | SEPCYCDQJZTPHO-UHFFFAOYSA-N |
Boiling Point: | 396.4 °C at 760 mmHg |
Melting Point: | 204-205 °C |
Purity: | 98 % |
Density: | 1.59 g/cm3 |
MDL: | MFCD00173907 |
LogP: | 1.55010 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation]; H319 (100%): Causes serious eye irritation [Warning Serious eye damage/eye irritation]; H335 (100%): May cause respiratory irritation [Warning Specific target organ toxicity, single exposure; Respiratory tract irritation] |
Precautionary Statement: | P261, P264, P264+P265, P271, P280, P302+P352, P304+P340, P305+P351+P338, P319, P321, P332+P317, P337+P317, P362+P364, P403+P233, P405, and P501 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 20180426 |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
Complexity: | 181 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 203.9760263 |
Formal Charge: | 0 |
Heavy Atom Count: | 12 |
Hydrogen Bond Acceptor Count: | 5 |
Hydrogen Bond Donor Count: | 1 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 203.9760263 |
Rotatable Bond Count: | 2 |
Topological Polar Surface Area: | 88.4 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 1.5 |
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