4,4'-Bis(5-hexyl-2-thienyl)-2,2'-bipyridyl - CAS 1047684-56-9
Catalog: |
BB001476 |
Product Name: |
4,4'-Bis(5-hexyl-2-thienyl)-2,2'-bipyridyl |
CAS: |
1047684-56-9 |
Synonyms: |
4-(5-hexyl-2-thiophenyl)-2-[4-(5-hexyl-2-thiophenyl)-2-pyridinyl]pyridine; 4-(5-hexylthiophen-2-yl)-2-[4-(5-hexylthiophen-2-yl)pyridin-2-yl]pyridine |
IUPAC Name: | 4-(5-hexylthiophen-2-yl)-2-[4-(5-hexylthiophen-2-yl)pyridin-2-yl]pyridine |
Description: | 4,4'-Bis(5-hexyl-2-thienyl)-2,2'-bipyridyl (CAS# 1047684-56-9) is used as a reactant in the synthesis of ruthenium(II) ligand complexes as sensitizers in dye-sensitized solar cells. |
Molecular Weight: | 488.75 |
Molecular Formula: | C30H36N2S2 |
Canonical SMILES: | CCCCCCC1=CC=C(S1)C2=CC(=NC=C2)C3=NC=CC(=C3)C4=CC=C(S4)CCCCCC |
InChI: | InChI=1S/C30H36N2S2/c1-3-5-7-9-11-25-13-15-29(33-25)23-17-19-31-27(21-23)28-22-24(18-20-32-28)30-16-14-26(34-30)12-10-8-6-4-2/h13-22H,3-12H2,1-2H3 |
InChI Key: | DCFNCZSDXIPGOQ-UHFFFAOYSA-N |
Purity: | > 98.0 % (HPLC) |
Appearance: | Solid |
Storage: | Sealed in dry, 2-8 °C |
MDL: | MFCD22581259 |
LogP: | 9.84620 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation] |
Precautionary Statement: | P264, P280, P302+P352, P305+P351+P338, P321, P332+P313, P337+P313, and P362 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 20180426 |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
US-2021277221-A1 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | 20180426 |
Complexity: | 510 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 488.23199150 |
Formal Charge: | 0 |
Heavy Atom Count: | 34 |
Hydrogen Bond Acceptor Count: | 4 |
Hydrogen Bond Donor Count: | 0 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 488.23199150 |
Rotatable Bond Count: | 13 |
Topological Polar Surface Area: | 82.3 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 9.8 |
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