2-Bromo-3-chloro-5-(trifluoromethyl)pyridine - CAS 75806-84-7
Catalog: |
BB035404 |
Product Name: |
2-Bromo-3-chloro-5-(trifluoromethyl)pyridine |
CAS: |
75806-84-7 |
Synonyms: |
2-bromo-3-chloro-5-(trifluoromethyl)pyridine; 2-bromo-3-chloro-5-(trifluoromethyl)pyridine |
IUPAC Name: | 2-bromo-3-chloro-5-(trifluoromethyl)pyridine |
Description: | 2-Bromo-3-chloro-5-(trifluoromethyl)pyridine (CAS# 75806-84-7) is a useful research chemical. |
Molecular Weight: | 260.44 |
Molecular Formula: | C6H2BrClF3N |
Canonical SMILES: | C1=C(C=NC(=C1Cl)Br)C(F)(F)F |
InChI: | InChI=1S/C6H2BrClF3N/c7-5-4(8)1-3(2-12-5)6(9,10)11/h1-2H |
InChI Key: | SMTKGMYGLYWNDL-UHFFFAOYSA-N |
Boiling Point: | 88-90 °C (15 mmHg) |
Density: | 1.509 g/cm3 |
MDL: | MFCD00153072 |
LogP: | 3.51630 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation] |
Precautionary Statement: | P261, P264, P271, P280, P302+P352, P304+P340, P305+P351+P338, P312, P321, P332+P313, P337+P313, P362, P403+P233, P405, and P501 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 20180426 |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
US-2021277221-A1 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | 20180426 |
Complexity: | 163 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 258.90112 |
Formal Charge: | 0 |
Heavy Atom Count: | 12 |
Hydrogen Bond Acceptor Count: | 4 |
Hydrogen Bond Donor Count: | 0 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 258.90112 |
Rotatable Bond Count: | 0 |
Topological Polar Surface Area: | 12.9 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 3.4 |
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