2-Amino-6-(Boc-amino)pyridine - CAS 322690-31-3
Catalog: |
BB021242 |
Product Name: |
2-Amino-6-(Boc-amino)pyridine |
CAS: |
322690-31-3 |
Synonyms: |
N-(6-amino-2-pyridinyl)carbamic acid tert-butyl ester; tert-butyl N-(6-aminopyridin-2-yl)carbamate |
IUPAC Name: | tert-butyl N-(6-aminopyridin-2-yl)carbamate |
Description: | 2-Amino-6-(Boc-amino)pyridine (CAS# 322690-31-3) is used in preparation of novel Macrocyclic Diacetylene compounds.Also, used in preparation of substituted Bicyclic Aza-Heterocycles and analogs as Sirtuin modulators. |
Molecular Weight: | 209.25 |
Molecular Formula: | C10H15N3O2 |
Canonical SMILES: | CC(C)(C)OC(=O)NC1=CC=CC(=N1)N |
InChI: | InChI=1S/C10H15N3O2/c1-10(2,3)15-9(14)13-8-6-4-5-7(11)12-8/h4-6H,1-3H3,(H3,11,12,13,14) |
InChI Key: | KEKAANXUQSMDMK-UHFFFAOYSA-N |
Boiling Point: | 307.148 °C at 760 mmHg |
Density: | 1.203 g/cm3 |
LogP: | 2.66500 |
GHS Hazard Statement: | H302 (50%): Harmful if swallowed [Warning Acute toxicity, oral] |
Precautionary Statement: | P261, P264, P270, P271, P280, P301+P312, P302+P352, P304+P312, P304+P340, P305+P351+P338, P312, P321, P322, P330, P332+P313, P337+P313, P362, P363, P403+P233, P405, and P501 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
US-2021277221-A1 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | 20180426 |
Complexity: | 225 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 209.116426730 |
Formal Charge: | 0 |
Heavy Atom Count: | 15 |
Hydrogen Bond Acceptor Count: | 4 |
Hydrogen Bond Donor Count: | 2 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 209.116426730 |
Rotatable Bond Count: | 3 |
Topological Polar Surface Area: | 77.2 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 1.4 |
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