2-Amino-3,5-dibromo-6-methylpyridine - CAS 91872-10-5
Catalog: |
BB040370 |
Product Name: |
2-Amino-3,5-dibromo-6-methylpyridine |
CAS: |
91872-10-5 |
Synonyms: |
3,5-dibromo-6-methylpyridin-2-amine |
IUPAC Name: | 3,5-dibromo-6-methylpyridin-2-amine |
Description: | 2-Amino-3,5-dibromo-6-methylpyridine (CAS# 91872-10-5) is a useful research chemical. It acts as a reagent in the synthesis of amino(aryl)pyrazines as inhibitors of human lactate dehydrogenase and in the synthesis of imidazopyridines as antiviral agents. |
Molecular Weight: | 265.93 |
Molecular Formula: | C6H6Br2N2 |
Canonical SMILES: | CC1=NC(=C(C=C1Br)Br)N |
InChI: | InChI=1S/C6H6Br2N2/c1-3-4(7)2-5(8)6(9)10-3/h2H,1H3,(H2,9,10) |
InChI Key: | BLUYMDMBXIMIGK-UHFFFAOYSA-N |
Boiling Point: | 93 °C |
Density: | 1.99 g/cm3 |
Appearance: | Off-white to light brown powder |
MDL: | MFCD00068229 |
LogP: | 3.07840 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation] |
Precautionary Statement: | P261, P264, P271, P280, P302+P352, P304+P340, P305+P351+P338, P312, P321, P332+P313, P337+P313, P362, P403+P233, P405, and P501 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 20180426 |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
Complexity: | 120 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 265.88772 |
Formal Charge: | 0 |
Heavy Atom Count: | 10 |
Hydrogen Bond Acceptor Count: | 2 |
Hydrogen Bond Donor Count: | 1 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 263.88977 |
Rotatable Bond Count: | 0 |
Topological Polar Surface Area: | 38.9 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | 2.3 |
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Amines and Anilines
Pyridines
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