2,4-Diamino-6-methoxypyrimidine - CAS 3270-97-1
Catalog: |
BB021377 |
Product Name: |
2,4-Diamino-6-methoxypyrimidine |
CAS: |
3270-97-1 |
Synonyms: |
6-methoxypyrimidine-2,4-diamine; 6-methoxypyrimidine-2,4-diamine |
IUPAC Name: | 6-methoxypyrimidine-2,4-diamine |
Description: | 2,4-Diamino-6-methoxypyrimidine (CAS# 3270-97-1 ) is a useful research chemical. |
Molecular Weight: | 140.14 |
Molecular Formula: | C5H8N4O |
Canonical SMILES: | COC1=NC(=NC(=C1)N)N |
InChI: | InChI=1S/C5H8N4O/c1-10-4-2-3(6)8-5(7)9-4/h2H,1H3,(H4,6,7,8,9) |
InChI Key: | OSBMJXWHJWWZJP-UHFFFAOYSA-N |
Boiling Point: | 429.4 °C at 760 mmHg |
Density: | 1.341 g/cm3 |
MDL: | MFCD02091088 |
LogP: | 0.81200 |
GHS Hazard Statement: | H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation] |
Precautionary Statement: | P264, P280, P302+P352, P305+P351+P338, P321, P332+P313, P337+P313, and P362 |
Signal Word: | Warning |
Publication Number | Title | Priority Date |
TW-202003734-A | Resin composition, laminate, semiconductor wafer with resin composition layer, mounting substrate for semiconductor with resin composition layer, and semiconductor device | 20180426 |
WO-2019208614-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
CN-112004845-A | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | 20180426 |
EP-3786200-A1 | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device | 20180426 |
KR-20210004971-A | Resin composition, laminate, semiconductor wafer with resin composition layer, semiconductor mounting substrate with resin composition layer, and semiconductor device | 20180426 |
Complexity: | 110 |
Compound Is Canonicalized: | Yes |
Covalently-Bonded Unit Count: | 1 |
Defined Atom Stereocenter Count: | 0 |
Defined Bond Stereocenter Count: | 0 |
Exact Mass: | 140.06981089 |
Formal Charge: | 0 |
Heavy Atom Count: | 10 |
Hydrogen Bond Acceptor Count: | 5 |
Hydrogen Bond Donor Count: | 2 |
Isotope Atom Count: | 0 |
Monoisotopic Mass: | 140.06981089 |
Rotatable Bond Count: | 1 |
Topological Polar Surface Area: | 87 Å2 |
Undefined Atom Stereocenter Count: | 0 |
Undefined Bond Stereocenter Count: | 0 |
XLogP3: | -0.2 |
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